Sony commercializes 16.41 Megapixel back-illuminated CMOS image sensors for mobile phones

Accoring to a press release "IMX081PQ" is world’s first (As of October 7, 2010) type 1/2.8 back-illuminated CMOS image sensor which realizes 16.41 effective megapixel resolution, and adopts the industry’s smallest unit pixel size of 1.12_m. "IMX105PQ" is a type 1/3.2 back-illuminated CMOS image sensor which realizes 8.13 effective megapixel resolutions for higher sensitivity and adopts a unit pixel size of 1.4_m. By embedding these highly sensitive sensors into mobile phones, including those without camera flash, users can capture high quality photos and videos even in low light settings.

Furthermore, Sony will commercialize "IU081F" and "IU105F2" compact auto-focus lens modules which include the two new "Exmor R" back-illuminated CMOS image sensors. These down-sized modules are suitable and efficient for mobile phones with relatively limited space and are equipped with high performance lens which maximize the image sensors’ respective performances. "IU081F" is the industry’s smallest and thinnest auto-focus lens module (W10.5 X D10.5 X H7.9mm) and is equipped with the 16.41 effective megapixel*2 CMOS image sensor.

"IU105F2" adopts the 8.13 effective megapixel CMOS image sensor, and belongs in the industry’s smallest and thinnest size class (W8.5 X D8.5 X H5.67mm). Through its proprietary fine pixel fabrication process technology, Sony will proactively continue the development of "Exmor R" which adopts the 1.12_m unit pixel size for mobile phones. Accordingly, Sony aims to address customer demand by providing appropriately small lens modules especially for smartphones with large displays and limited space for components.

Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm) at Sony Semiconductor Kyushu Corporation’s Nagasaki Technology Center. At the end of 2010, Sony plans to start the mass production of "Exmor R," including those for mobile phones announced today, at Sony Semiconductor Kyushu Corporation’s Kumamoto Technology Center, on cutting-edge wafer lines (with diameter of 300mm). Sony already announced (September 1, 2010) the investment of approximately 40 billion yen in Kumamoto Technology Center to increase production capacity for CMOS image sensors.